ECTC 2009

Major Topics

Papers presenting new developments and knowledge in the following areas are invited. Please select two subcommittees that should consider your paper. The work submit- ted should be original,not previously published,and avoid the inclusion of com- mercial content.

- Advanced Packaging: Design,development,fabrication,testing,and characterization of advanced packaging and novel component integration technologies involving elec- tronics,photonics,MEMS and their innovative configurations for applications related to computing,sensing,imaging,photovoltaic,high power and bio-medical systems. Special emphasis will be on solutions for high performance,density,and thermal management related to systems involving 3D integration,through silicon vias (TSVs),flip-chip,and fine pitch and high lead count packaging in CSP, WLP, BGA,CGA,LGA and SMT pack- ages for both Pb-based and Pb-free packages.

- Applied Reliability: Advances in reliability assessment and prediction at the system, PWB or package level,reliability testing and data analysis,reliability modeling of ac- celerated testing,reliability issues in emerging technologies,medical electronics and consumer electronics,reliability physics,reliability predictions,reliability test methods and failure analysis.

- Assembly and Manufacturing Technology:Advanced process and equipment im- provement for volume production of emerging technology,including: Advanced pack- aging,system in package,package on package,bumping and flip chip,die thinning and stacking,low-K device,photonic device ,MEMS and optoelectonics,product and sys- tem level assembly,electrical/mechanical/green performance and board level assembly.

- Electronic Components & RF: Discrete Passive Components;integrated and embedded passive and active components integration on silicon ceramic,organic substrates;electronic components-design,materials,processing,test,characterization; new technology development for components - silicon through vias,wafer level RDL, nano materials and processes;tunable materials,structures,devices and switches; RFID/sensors,RF MEMS,integrated antennas,filters,baluns;components and modules for WLAN,UWB,mobile PC and multi-band radio applications.

- Emerging Technologies: Design,fabrication,modeling and performance aspects of materials,devices,systems and packaging in the areas of bioelectronics such as bio- medical,bioengineering,biosensors and electronics for medical devices;organic/print- able electronics;portable power supplies such as fuel cells;and other novel packaging.

- Interconnections: Interconnect innovation/design/process on all packaging levels including wire bonding,flip chip,3D and through Si via connections,first-level package and printed circuit board. Topics may range from bump and under bump metallurgy, electromigration,conductive polymers and nano material based interconnects,novel enabling techniques,electrical performance,to environmental concerns.

- Materials & Processing: Materials and processes for traditional and advanced micro- electronic systems,3D packages,WLP andTSV,photonics,MEMS,solar and biomedical packaging that enhance mechanical,thermal,electrical and optical performance and cost effectiveness. This includes advances in adhesives,nano-materials,embedded active and passive components,flexible and printed electronics,magnetic,optical and thermal interface materials,Pb-free solders,alloys and assembly processes.

�?� Modeling & Simulation: Electrical,thermal,optical and mechanical modeling,simula- tion and characterization of packaging solutions including system-level applications. Example topics include assembly manufacture modeling,Cu low-K interconnects,drop impact models,embedded passives,equivalent circuit models,fullwave modeling,lead- free solders,macromodeling,measurements and thermo-mechanical reliability.

- Optoelectronics: Packaging and technology for optoelectronic modules,components and devices including amplifiers,transmitters,receivers,integrated photonics,passive components,fiber optics,optical sensors,chip-chip,backplanes interconnect and stor- age. Special interest topics include high power lasers,high-brightness LEDs,thermal management and reliability,micro-optic packaging & manufacturing,silicon photonics, photovoltaics,integrated optical sensors,nano-optics,RF over fiber,optoelectronics for space applications and harsh environments,and advanced optoelectronic materials.

- Posters: Papers may be submitted on any of the listed major topics;presentation of papers in a poster format is highly encouraged at ECTC.

Paper Submission

You are invited to submit a 750-word abstract that describes the scope,content,and key points of your proposed paper via the ECTC website at www.ectc.net. Please check the website for details on how to submit abstracts electronically. For additional information regarding abstract and paper submissions,please contact rajen.c.dias@intel.com.

Abstracts must be received by October 15, 2008. Your submission must include the mailing address,business telephone number,facsimile number and email address of the presenting author and affiliations of all authors. Please indicate two program subcommittees in order of preference that should evaluate your paper for acceptance. Authors will be notified of paper acceptance with instructions for publication by December 15,2008. At the discretion of the program committee,abstracts submitted may be considered for poster sessions.

Manuscripts are due in final form for publication in the Conference Proceedings by February 25,2009. The work submitted should be original,not previously published,and avoid inclusion of commercial content. In addition to a printed copy conforming to the ECTC format,a computer file for the CD-ROM is needed in the preferred MSWord format.

Special Paper Recognition

Best PaperAward: Each year the ECTC selects the best paper whose author(s) receive an ECTC personalized wall plaque and share a check for $2500.

Best Poster Award: Each year the ECTC selects the best poster paper whose author(s) receive an ECTC personalized wall plaque and share a check for $1500.

Outstanding Paper Award: An outstanding conference paper is also selected for special recognition by the ECTC. The author(s) receive a personalized wall plaque and share a check for $1000.

Outstanding Poster Award: An outstanding poster paper is also selected for special recognition by the ECTC. The author(s) receive a personalized wall plaque and share a check for $1000.

Intel Best Student PaperAward: Intel Corporation is sponsoring an award for the best paper submitted and presented by a student at the ECTC. The winning student will be presented with a wall plaque and a check for $2500. See next column for details.

IEEE CPMT Transactions: In addition to the publication of papers in the Conference Proceedings,a selection of the top papers is published in a special issue of the IEEE CPMTTransactions. This CfP was obtained from WikiCFP