ASMC 2009

The 20th Annual IEEE/SEMI® Advanced Semiconductor Manufacturing Conference (ASMC 2009) May 10-12, 2009 -- Berlin, Germany

ASMC, now in its 20th year, fills a critical need in our industry by providing the opportunity and the venue for technical managers, hands-on engineers, and other semiconductor industry professionals to network, learn, and share knowledge on new and best-method semiconductor manufacturing practices and concepts. With the dynamic nature of our industry, information sharing across sectors is a vital aspect of innovation and continuous improvement. This shared knowledge continues at ASMC 2009. Call for Papers topics

SEMI® and IEEE are now soliciting technical abstracts on a range of fab performance issues:

* Advanced Metrology * Advanced Processes and Materials * Advanced Process Control * Analog, High Power and High Voltage * Contamination Free Manufacturing (CFM) * Cost Effectiveness and Manufacturing Efficiency * Defect Inspection and Reduction * Design for Manufacturability (DFM) * Enabling Technologies and Innovative Devices * Equipment Reliability and Productivity * Factory Automation and Dynamics * Industrial Engineering * Lithography Advances/Challenges * Wafer Level Packaging * Yield Enhancement and Yield Modeling

Contact Us

For further conference information and details about sponsorship opportunities, please contact Margaret Kindling, SEMI senior program manager, mkindling@semi.org, or call 1.202.289.0440. To order the CD-ROM of the ASMC 2008 technical proceedings, please contact SEMI customer service at 1.408.943.6901. Committee

Our special appreciation to the ASMC committee members who volunteer countless hours in support of ASMC.

ASMC 2009 Conference Co-chairmen: Walter Schoenleber, Applied Materials Brett Williams, ON Semiconductor Steering and Technical Committee:

Jeff Barnum, KLA-Tencor Corp. Thomas Beeg, Qimonda Jennifer Braggin, Entegris (IMEC assignee) Duane Boning, PhD., MIT - Dept. of EE&CS Thomas Carbone, Fairchild Semiconductor John Conway, Intel Corporation Russell Dover, KLA-Tencor Eric T. Eisenbraun, PhD., University at Albany Eric Englhardt, Applied Materials José Estabil, Massachusetts Institute of Technology Pascal Etman, Eindhoven University of Technology Patrice Flack, PhD., Integrated Materials, Inc. Ahmad Fathulla, PhD., Infineon Technologies Villach Rainer Gehres, IBM Systems & Technology Group John Goodman, Entegris, Inc. Nirmal Govind, PhD., Intel Corporation Gary Green, Synopsys, Inc. Dave Gross. Advanced Micro Devices Christopher Hess, PDF Solutions, Inc. Dick James, Chipworks Inc. Greg Klusewitz, Fairchild Semiconductor Chris Konarski, IBM Microelectronics Scott Lantz, Intel Corporation Steven Leibiger, Fairchild Semiconductor Corporation Holly Magoon, Nikon Precision, Inc. Daniel Maynard, IBM Microelectronics Scott McClure, IBM Systems & Technology Group Graham McFarlane, Linde Electronics Mike McIntyre, Advanced Micro Devices Winfried Meier, Nikon Precision Europe GmbH Hanno Melzner, Infineon Technologies AG William Miller, IBM Microelectronics Kevin Nason, Fairchild Semiconductor Mark Nelson, ON Semiconductor Kazunori Nemoto, Ph.D., Hitachi High Technologies Oliver D. Patterson, PhD, IBM Microelectronics Thomas Piliszczuk PhD., KLA-Tencor France Larry Pulvirent, Freescale Semiconductor Dieter Rathei, D R YIELD software & solutions Ron Remke, International SEMATECH Theresa Roeder, PhD., San Francisco State University Leonard Rubin, Ph.D., Axcelis Technologies, Inc. Walter Schoenleber, Applied Materials Arthur Tay, PhD., National University of Singapore Thuy Tran-Quinn, NXP Semiconductors Helmuth Treichel, Xyratex William Tyler, FSI International Jacek Tyminski, PhD., Nikon Precision Inc. Peter van der Meulen, BlueShift Technologies Paul Werbaneth, Tegal Corp. Brett Williams, ON Semiconductor Kenny Ye, PhD., Hitachi High Technologies America This CfP was obtained from WikiCFP